HP 2312TU Informazioni Techniche Pagina 87

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel Celeron processor.
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it
Reverse this procedure to reassemble and install the fan/heat sink assembly.
Component replacement procedures 79
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