HP WS460c Manuale Utente

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HP ProLiant WS460c G6 Workstation Blade
1.
Two (2) mezzanine I/O expansion slots
5.
Two (2) small form factor (SFF) hot-plug drive bays
2.
Internal USB connector
6.
Local I/O Connector
3.
Twelve (12) DDR3 Registered or Unbuffered DIMM Memory
Slots
7.
Internal SD card slot
8.
Up to two (2) Intel® Xeon® 5500 series processors
4.
HP Smart Array P410i Controller
9.
Access Panel
At A Glance
This document covers the HP ProLiant WS460c G6 workstation blade only. For more information on HP BladeSystem c-Class
Infrastructure and HP BladeSystem c-Class Interconnect Components, please see the following QuickSpecs:
HP BladeSystem c-Class Enclosures QuickSpecs:
HP BladeSystem c3000 Enclosure QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12790_div/12790_div.html
HP BladeSystem c7000 Enclosure QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12810_div/12810_div.html
HP BladeSystem c-Class Interconnect Components QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12524_div/12524_div.html
The HP ProLiant WS460c G6 provides greater 2P x86 server blade density without compromise and maximum power-efficiency with
flexibility and choice.
HP ProLiant WS460c G6 workstation blade includes:
Processor
:
Up to two (2) Intel® Xeon® 5500 Series processors
Intel® 5500 Chipset
Memory
:
Twelve (12) DIMM slots
Up to 96GB, using PC3-10600 DDR3 Registered (RDIMM) memory
QuickSpecs
HP ProLiant WS460c Generation 6 (G6) Workstation
Blade
Overview
DA - 13429 Worldwide QuickSpecs — Version 3 — 2.16.2010
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Sommario

Pagina 1 - QuickSpecs

HP ProLiant WS460c G6 Workstation Blade1.Two (2) mezzanine I/O expansion slots5.Two (2) small form factor (SFF) hot-plug drive bays2.Internal USB co

Pagina 2

NOTE: This section lists some of the steps required to configure a Factory Integrated Model. To ensure only valid configurations areordered, HP recomm

Pagina 3

Intel® Xeon® processor HP L5506 (2.13 GHz, 4MB L3 Cache, 60W, DDR3-800)BL460c G6 Kit, FIONOTE: If two processors are desired, select one 513859-L21 an

Pagina 4

Step 4: Choose Additional Options for Factory IntegrationNOTE: For additional options, please refer to the "Core Options" and "Addition

Pagina 5

HP ProcessorsQuad-Core Process Option Kits Intel® Xeon® Processor X5570 (2.93 GHz, 8MB L3 Cache, 95W, DDR3-1333, HT,Turbo 2/2/3/3) BL460c G6 Kit507791

Pagina 6

HP Hard DrivesSAS Hot Plug SFF (2.5-inch) Enterprise (ENT) Drives HP 300GB 3G SAS 10K SFF (2.5-inch) Dual Port Enterprise 3yr Warranty Hard Drive49262

Pagina 7

HP Remote AccessHP Remote Graphics Software (RGS) v5.3.0 NOTE: HP RGS is a licensed software sold separately. Not bundled with HPWS460c G6.NOTE: For r

Pagina 8

HP StorageWorks SB40cStorage BladeHP StorageWorks SB40c Storage Blade411243-B21NOTE: Please see the QuickSpecs for Technical Specifications and additi

Pagina 9

NOTE: Memory configurations listed do not apply to "Factory Integrated Models".Memory Population GuidelinesFor detailed memory configuration

Pagina 10

95 Watt CPU's are required for 1333MHz DIMM speedsReferences to the above MHz speeds are for the various speeds of DDR3 DIMMs; 1333 refers to DDR

Pagina 11

CPU1 CPU2 slot #population orderslot #population order Chnl 11D: 1GB DIMM (if4GB model),2GB DIMM (if 2GBmodel)1D: emptyChnl 12A: 1GB DIMM2A: empty

Pagina 12

Up to 24GB, using PC3-10600 DDR3 Unbuffered (UDIMM) memory, operating at 1066MHz when fully populated at2 DIMMs per Channel in 12 slotStorage Controll

Pagina 13

UDIMM maximum configuration (2 CPU model)24GB, consisting of twelve (12) 2GB dual-rank PC3-10600 UDIMMs CPU1 CPU2 slot #population orderslot #populat

Pagina 14

1-22 x SFF SAS Hot Plug Hard DrivesHard DrivesNOTE: The components of a storage subsystem (e.g. the drive, the HBA/controller, firmware, and the serve

Pagina 15

System UnitDimensions (H x W x D)(with bezel)7.154 x 2.19 x 20.058 in (18.17 x 5.56 x 50.95 cm)Weight(approximate)Maximum(all hard drives andprocessor

Pagina 16

http://h18000.www1.hp.com/products/quickspecs/12790_div/12790_div.htmlHP BladeSystem c7000 Enclosure QuickSpecs:http://h18000.www1.hp.com/products/qui

Pagina 17

Environment-friendlyProducts and ApproachEnd-of-life Managementand RecyclingHewlett-Packard offers end-of-life HP product return, trade-in, and recycl

Pagina 18

management console.NOTE: ICE-Linux is not supported in the WS460c G6.Operating Systems:Supports following: (Not preinstalled or preloaded)Genuine Micr

Pagina 19

ProcessorQuad-Core ProcessorsIntel® Xeon® Processor X5570 (2.93 GHz, 8MB L3 Cache, 95W, DDR3-1333, HT, Turbo 2/2/3/3)Intel® Xeon® Processor X5560 (2.8

Pagina 20

MemoryTypeDDR3 Registered (RDIMM)Standard2GB (2 x 1GB) UDIMM4GB (4 x 1GB) UDIMMMaximum (RDIMM)96GB (12 x 8 GB) for Registered Memory configurationsMax

Pagina 21

Number of displaysUp to two displaysGraphics driverSingle, unified driver compatible with FX 770M and FX 3600MIntegrated ManageabilityProLiant Onboard

Pagina 22

Compatible SANHP ProLiant WS460c G6 workstation blades are optimized for HP StorageWorks MSA, EVA and XP.HP ProLiant 460c G6 server blades are compati

Pagina 23

Factory Express Portfoliofor Servers and StorageHP Factory Express offers configuration, customization, integration and deployment services for HP ser

Pagina 24

FX 770M graphics preconfigured modelsHP WS460c G6 E55404GB (1P) Dual FX770M(quad display)580641-B21HP WS460c G6 E55302GB (1P) Single FX770M(dual displ

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